英文版芯片封装.ppt

IC PACKAGING IC PACKAGING SEMICONDUCTOR MFG(BACK-END/PACKAGING) SMT PLASTIC PACKAGE : WAFER SAW/DICING DIE ATTACH/MOUNT WIRE BONDING MOLDING/ENCAPSULATION CROPPING/TRIM&FORM SOLDER DIPPING TESTING PACKING & SHIPPING SEMICONDUCTOR MFG(BACK-END/PACKAGING) BGA : WAFER SAW/ DICING DIE ATTACH/ MOUNT WIRE BONDING MOLDING/ ENCAPSULATION SAWING SOLDER BALL ATTACH TESTING PACKING & SHIPPING WAFER SAW/DICING WAFER SAW/DICING WAFER SAW/DICING Singulation of individual die : Mounting tape & frame Saw blades Washing Tape Curing DIE ATTACH/MOUNT DIE ATTACH/MOUNT Attach die to leadframe/substrate : Epoxy glue dispensing unto leadframe Die attach Epoxy glue curing WIRE BONDING WIRE BONDING Connect die to external leads : Wires – Au/Cu/Al Thermo sonic bonding 1st Bond – Ball bond 2nd Bond – Stitch bond MOLD/ENCAPSULATION MOLD/ENCAPSULATION Protect internal circuit from external environment : Transfer molding Mold curing CROPPING/TRIM&FORM CROPPING/TRIM&FORM/MARKING Singulation of individual IC unit (end product) : Cut dambars and unwanted leadframe Form leads per specification Marking : Laser marking Print SOLDER DIPPING SOLDER DIPPING Lead finishing with coated solder : Flux Solder dip TESTING TESTING 100% testing of all units : Continuity failure Functional failure Parametric failure PACKING & SHIPPING PACKING & SHIPPING Packing & shipping of parts to customers : Reels, trays, tubes Dry-pack Labellings PACKING & SHIPPING New Traceability Code : PPYWWLLL (June – Dec 2003) PP = Traceability production area code Y = Year WW = Work Week LLL = Alphanumeric characters * * PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB2004 PREPARED BY : SS SENG/24FEB200