J-STD-033D处理，包装，运输和使用湿度，回流，和过程敏感设备.docx

Downloaded by Harlan Jack (txsjd666@163.com) on Oct 20, 2023, 12:42 am PDT Downloaded by Harlan Jack (txsjd666@163.com) on Oct 20, 2023, 12:42 am PDT JOINT INDUSTRY STANDARD IPC/JEDEC J-STD-033D April 2018 Supersedes IPC/JEDEC J-STD-033C-1 August 2014 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices Notice JEDEC and IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by JEDEC and IPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, JEDEC and IPC do not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. The material in this joint standard was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the IPC Plastic Chip Carrier Cracking Task Group (B-10a) For Technical Information Contact: JEDEC Solid State Technology Association 3103 North 10th Street, Suite 240-S Arlington, VA 22201-2107 Tel 703 907.0026 Fax 703 907.7501 IPC 3000 Lakeside Drive, Suite 105N Bannockburn, Illinois 60015-124