J-STD-033D 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用(中文版).docx

J-STD-033D J-STD-033D(中文版) 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用 FOREWORD/前言 The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as "cracks and delamination" from the solder reflow process. This document describes the standardized levels of floor-life exposure for moisture/reflow sensitive SMDs along with the handling,packing and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020,J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively. SMD 零件的出现直接带来了一类新的质量和可靠性问题，涉及回流焊过程中的“裂纹和分层”等损伤。本文件描述了对潮气/回流敏感的smd 的现场寿命(裸露寿命)暴露的标准化水平，以及为避免潮气/回流相关故障所必需的处理、包装和运输要求。配套文件J-STD-020、J-STD-075和JEP113 分别定义了分类程序和标签要求。 For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 ℃ During solder reflow, the combination of rapid moisture expansion,materials mismatch, and material interface degradation can result in cracking and/ or delamination of critical interfaces within the device. 对于湿度敏感器件，水气会通过包装材料渗透到包装内部，并在不同材料的表面聚结。在组装工艺中， SMD 元件贴装在 PCB 上时会经历超过200℃的高温，在焊接时因湿气的膨胀会造成一系列的焊接品质问题。 Typical solder reflow processes of concern for all devices are convection, convection/ IR, infrared (IR), vapor phase( VPR), hot air rework tools, and wave solder, including full immersion. 所有器件所关注的典型回流焊工艺包括对流、对流/IR、 红外 (IR)、 气相 (VPR)、 热风返工工具和波峰焊，包括全浸焊。 Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity, flux sensitivity or cleaning process sensitivity. 非半导体器件可表现出超过湿度敏感性的额外工艺敏感性，例如热敏感性、熔解敏感性或清洁工艺 敏感性。 Purpose /目的 The purpose of this document is to provide manufacturers users with standardized methods for handling,packing, shipping, and use of moisture/reflow and process sensitive devices that have