系热敏电阻器配方及工艺.docx

西安电子科技大学 硕士学位论文 Mn--Co--Ni--Cu系热敏电阻器配方及工艺研究 姓名：张大伟 申请学位级别：硕士 专业：材料学 指导教师：曹全喜 201112 摘要摘要 摘要 摘要 负温度系数(NTC)热敏电．阻元件作为发展较为成熟的基础电子元器件，已经广 泛应用到电子行业的各个领域。而其中Mn．Co-Ni．Cu系热敏电阻目前生产规模较 大，生产中也出现许多值得探讨的问题，故对此的研究具有较高的理论与实践价 值。 本文主要研究Mn．Co-Ni．Cu系负温度系数热敏电阻元件的配方与制造工艺， 包括各种添加剂的作用、特别是V和Bi元素对元件性能的影响和若干工艺条件的 优化。 具体来讲，Mn．Co-Ni．Cu四元系热敏电阻在25℃至300℃范围内具有负阻值 特性，可用于制备负温度系数热敏电阻。 为满足厂方提出的要求，在原配方的基 础上，制造出不同室温电阻值的NTCR， 尝试了V205及助熔剂Bi203，通过尝试 不同含量的掺杂，寻找到了符合要求的新配方。同时，进行了不同最高烧结温度 的实验，寻找到了符合实验要求的新的烧结曲线，在该烧结曲线下粒径及致密度 都得到了较大的提高。最后，对新配方进行了SEM和EDS分析，深入了解新配 方所制样片的微观原子分布。 关键词：Mn．Co-Ni．Cu负温度系数热敏电阻配方V205 Bi203工艺优化 ABSTRACTABSTRACT ABSTRACT ABSTRACT As developed basic electronic components，negative temperature coefficient resistance elements have been used in varies of fields in electronic industry．In these devices，Mn—Co-Ni-Cu series have a larger manufacture scale with some significant problems in producing process．Thus，research on this has a high value in theory and practice． This dissertation studies the Mn-Co-Ni-Cu system with negative temperature coefficient thermistor element formulation and manufacturing process，including the role of various additives，in particular,V and Bi elements on a number of component performances and optimization of process conditions． Specifically,Mn·Co—Ni·Cu quaternary system thermal resistance at 25℃to 300℃ with a range of negative resistance characteristics，Can be used to prepare a negative temperature coefficient thermistor．To meet the plant's request 0n the basis of the original formula,to create a different room·temperature resistivity values NTCR，tried and flux，by trying different amountS of doping required to find the symbol of the new formula．At the same time，the maximum sintefing temperature of different experiments， to meet the test requirements to find a new sintering curve，the particle size and sintered density under the curve have been greatly improved．Finally,the new formula for the SEM and EDS analysis，in·depth understanding of the new formulation of the microsco