原创力文档AEC - Q101_Rev_E_Stress Test Qualification For Discrete Semiconductors - base document only with no test methods 分立器件应力.pdf
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AEC - Q101 - Rev - E
March 1, 2021
FAILURE MECHANISM BASED
STRESS TEST QUALIFICATION
FOR
DISCRETE SEMICONDUCTORS
IN AUTOMOTIVE APPLICATIONS
Automotive Electronics Council
Component Technical Committee
AEC - Q101 - Rev - E
March 1, 2021
Automotive Electronics Council
Component Technical Committee
TABLE OF CONTENTS
AEC-Q101 Failure Mechanism Based Stress Test Qualification for Discrete
Semiconductors in Automotive Applications
Appendix 1: Definition of a Qualification Family
Appendix 2: Q101 Certification of Design, Construction and Qualification
Appendix 3: Qualification Plan
Appendix 4: Data Presentation Format
Appendix 5: Minimum Parametric Test Requirements
Appendix 6: Plastic Package Opening for Wire Bond Testing and Inspection
Appendix 7: AEC-Q101 and the Use of Mission Profiles
Attachments
AEC-Q101-001: Electrostatic Discharge Test - Human Body Model
AEC-Q101-002: Electrostatic Discharge Test - Machine Model (DECOMMISSIONED)
AEC-Q101-003: Wire Bond Shear Test
AEC-Q101-004: Miscellaneous Test Methods
AEC-Q101-005: Electrostatic Discharge Test – Charged Device Model
AEC-Q101-006: Short Circuit Reliability Characterization of Smart Power Devices for 12V
Systems
AEC - Q101 - Rev - E
March 1, 2021
Automotive Electronics Council
Component Technical Committee
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