GB∕T 41852-2022 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法..pdf

ICS31.080.99

CCSL55

中华人民共和国国家标准

GB/T41852-2022/IEC62047-13:2012

半导体器件微机电器件MEMS结构

站结强度的弯曲和剪切试验方法

Semiconductordevices-Micro-electromechanical

devices-Bend-andshear-typetestmethods

ofmeasuringadhesivestrengthforMEMSstructures

CIEC62047-13:2012,Semiconductordevices-Micro-electromechanical

devices-Part13:Bend-andshear-typetestmethodsof

measuringadhesivestrengthfor队!JEMSstructures,IDT)

2022-10-12发布2022-10-12实施

国家市场监督管理总局中＋

国家标准化管理委员会/.X.~IJ

GB/T41852-2022/IEC62047-13:2012

目次

前言………………········…··················………·········……………·…I

1范罔……………

2规范性引用文件…

3术语和l定义……

4试验方法……………··

4.1通则

4.2数据分析········………………··················…………··················………….3

5试验设备…········…··················………··嗣……………··················…………….4

5.1通WJ…………………4

5.2执行器……··咱………………·……4

5.3测力传感然…………………………4

5.4校？在系统……………4

5.5记录仪………………4

6试样·················……··················……··嗣………………··················………….4

6.1试样设计……………4

6.2成样制备…………·……….5

7试验条件..............………………....................…....................……·…5

7.1安装方法…··唱………………·……5

7.2试验速度········…··················……··嗣……………··················…………….5

7.3试样校准……………5

7.4试验环境·······