SiliconSubstrateInterconnectionCircuitDesign硅基片上光互连电路.PDF

Optoelectronics 光电子, 2016, 6(2), 47-53 Published Online June 2016 in Hans. /journal/oe /10.12677/oe.2016.62008 Silicon Substrate Interconnection Circuit Design Xiong Tang, Rensen Fan, Zhengfei Ma, Kaikai Xu, Qi Yu Microelectronics and Solid Electronics Institute, University of Electronic Science and Technology of China, Chengdu Sichuan th th st Received: May 28 , 2016; accepted: Jun. 18 , 2016; published: Jun. 21 , 2016 Copyright © 2016 by authors and Hans Publishers Inc. This work is licensed under the Creative Commons Attribution International License (CC BY). /licenses/by/4.0/ Abstract According to Moore’s Law, chip integration density continues to increase. Because of limited elec- trical interconnection physical characteristics, the transmission delay, bandwidth, density and power consumption of the traditional on-chip interconnect technology and other key performance indicators are difficult to be improved, which have become resistance and bottleneck to further enhance the SoC performance. Instead, optical interconnect signal transmission has low loss, high speed, low latency and high bandwidth density advantages. Therefore, optical interconnection technology has potential advantages in the application of SoC. This paper describes the imple- mentation of the simple optical interconnection circuit under the standard CMOS process and the basic light principle light of light-emitting device. Silicon light source plays an important role in the interconnection; the paper made a focus on the silicon light-emitting, and reviewed the last few years’ research about silicon light source. Ba