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SiC芯片器件研发及产业化建设项目-扬杰科技
SiC芯片、器件研发及产业化建设项目
环境影响报告书
(公示版)
扬州扬杰电子科技股份有限公司
二○一五年十月
SiC芯片、器件研发及产业化建设项目环境影响报告书
一、 建设单位情况
建设单位：扬州扬杰电子科技股份有限公司
项目名称：节能型功率器件芯片建设项目
项目投资：39773万元
建设地点：扬州市维扬经济开发区荷叶西路 6号扬州扬杰电子科技股份有限公司
厂区内
联系人：韩工
电话：0514
传真：0514
电子邮箱：hanya@21
二、 环评单位情况
评价单位：扬州美境环保科技有限责任公司
单位所在地：扬州市扬子江北路 413号 （中集 ·格兰云天大酒店对面）
联系人：赵工
联系电话：05148011
传真：0514
E-mail：yzhks115@163.com
SiC芯片、器件研发及产业化建设项目环境影响报告书
目 录
1 前 ··························································································································7
1.1 项目由来·············································································································7
1.2 项目特点·············································································································7
1.3 环境影响评价工作程序···························································································8
1.4 本项目主要环境问题······························································································8
1.5 环境影响评价主要结论···························································································9
2 总则·························································································································10
2.1 编制依据············································································································10
2.1.1 环境保护法律、法规及规范性文件······················································································10
2.1.2 相关技术文件及参考文献······································································································14
2.1.3 项目有关文件及资料···················································································
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