微电子关键性材料-光刻胶的现状与未来.ppt

微电子关键性材料-光刻胶的现状与未来.ppt

  1. 1、本文档共33页,可阅读全部内容。
  2. 2、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
  3. 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载
  4. 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
微电子关键性材料-光刻胶的现状与未来

紫外负性光刻胶(Polyisoprene Base); 紫外正性光刻胶,包括G线胶 (436nm)、I线胶 (365 nm); 深紫外光刻胶,包括KrF-248nm胶、ArF-193nm胶等; 目前最热门的 ArF-193nm Immersion; 极紫外-EUV(13.4n)和Imprint Tech-nology尚在研发探索中,而曾经喧嚣一时的F2-157mm已经出局。 Concept – Introduce a liquid between the lens and wafer Effect - Raise the NA of the stepper and thereby increase resolution ? Light acts like it is a shorter wavelength Those light rays which enter the final lens element at are reflected at the lens/air interface and not brought into focus Refractive index dependent Improved resolution Improved DOF at a given resolution Conserves infrastructure Light sources Masks, pellicles,optical materials Coatings Resists? Transparent at the exposing l Non-volatile Non-toxic Not interact with lens coatings Stable to exposing radiation Must not intact with resist Large effort at Motorola Two companies in US Nanoimprints – Austin, TX Supported by UTexas (G. Willson)/Motorola Nanonex – Princeton, NJ Princeton U./ Stephen Chou IBM showed chemical structures in their series of talks which centered on fluoro-alcohol polymers for 193i as both additives and top coats. In the first of these they compared and contrasted a number of hexafluoroisopropanol-containing (HFA) polymers where the HFA group was placed in different positions in the polymer backbone. The following two structures are representative of the point they were trying to make. * * May, 2007 G线胶436nm I线胶365nm KrF248nm ArF193nm D ArF193nm i ArF193nm i EUV Imprint ? 1um 500nm 250nm 130nm 90nm 65nm 45nm 32nm 22nm ? ArF-193i ArF-193i ArF-193 ArF-193 KrF-248 对应的光刻胶 32 45 65 90 130 180 线宽(nm) 256G 64G 16G 4G 1G 256M 集成度 2010 2008 2006 2004 2002 2000 投产年份 低 中 高 工程师的认可度 技术背离传统的主流光刻技术 掩膜(PSM)缺陷、表面平整度及厚度控制 双重曝光一起的交叉朴光的临近效应 技术难点 $5M $60M $35M 设备成本 适中 庞大 大 设备体积 5~50 mJ/cm2 30~50 mJ/cm2 光刻胶的敏感度 high 5-100wph 60-100wph 产率 Imprints 极紫外-EUV 193nm 浸

文档评论(0)

pangzilva + 关注
实名认证
内容提供者

该用户很懒,什么也没介绍

1亿VIP精品文档

相关文档